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VLSI-SoC 2023innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	VLSI-SoC 2023edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha.
其他題名:	innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
其他作者:	Elfadel, Ibrahim M.
團體作者:
出版者:	Cham :Springer Nature Switzerland :2024.
面頁冊數:	xii, 320 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Integrated circuitsCongresses.Very large scale integration
電子資源:	https://doi.org/10.1007/978-3-031-70947-0
ISBN:	9783031709470$q(electronic bk.)

VLSI-SoC 2023innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
VLSI-SoC 2023innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /[electronic resource] :edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha. - Cham :Springer Nature Switzerland :2024. - xii, 320 p. :ill. (some col.), digital ;24 cm. - IFIP advances in information and communication technology,6801868-422X ;. - IFIP advances in information and communication technology ;370..

Architectures -- Synthesis of SFQ Circuits with Compound Gates -- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures -- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories -- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure -- Accelerators -- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility -- Accelerating Large Kernel Convolutions with Nested Winograd Transformation -- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator -- Resiliency and Robustness -- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats -- Advanced Quality Assurance Platform for Robust Process Design Kits -- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products -- Radiation Tolerant 14T SRAM Cell for Avionics Applications -- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect -- Security and Privacy -- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature -- Confidential Inference in Decision Trees -- Enhancing the Security of IJTAG network using Inherently Secure SIB.

This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023. The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.

ISBN: 9783031709470$q(electronic bk.)

Standard No.: 10.1007/978-3-031-70947-0doiSubjects--Topical Terms:

484911
Integrated circuits
--Very large scale integration--Congresses.

LC Class. No.: TK7874

Dewey Class. No.: 621.395

VLSI-SoC 2023innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
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