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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposiumedited by Nurul Razliana Abdul Razak ... [et al.].
其他題名:	EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
其他題名:	EPITS 2024
其他作者:	Abdul Razak, Nurul Razliana.
團體作者:
出版者:	Singapore :Springer Nature Singapore :2025.
面頁冊數:	xiii, 421 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Electronic packagingHandbooks, manuals, etc.
電子資源:	https://doi.org/10.1007/978-981-96-2871-1
ISBN:	9789819628711$q(electronic bk.)

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /[electronic resource] :EPITS 2024edited by Nurul Razliana Abdul Razak ... [et al.]. - Singapore :Springer Nature Singapore :2025. - xiii, 421 p. :ill., digital ;24 cm. - Springer proceedings in physics,4181867-4941 ;. - Springer proceedings in physics ;v. 98..

Electronic Packaging -- Advanced Materials -- Green Materials -- Surface Coating.

This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.

ISBN: 9789819628711$q(electronic bk.)

Standard No.: 10.1007/978-981-96-2871-1doiSubjects--Topical Terms:

435082
Electronic packaging
--Handbooks, manuals, etc.

LC Class. No.: TK7870.15 / .E54 2024

Dewey Class. No.: 621.381046

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
LDR:02489nmm a2200349 a 4500 001 680523
003 DE-He213
005 20250312115243.0
006 m d
007 cr nn 008maaau
008 251110s2025 si s 0 eng d
020 $a 9789819628711$q(electronic bk.)
020 $a 9789819628704$q(paper)
024 7 $a 10.1007/978-981-96-2871-1 $2 doi
035 $a 978-981-96-2871-1
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7870.15 $b .E54 2024
072 7 $a PHFC $2 bicssc
072 7 $a SCI077000 $2 bisacsh
072 7 $a PHFC $2 thema
082 0 4 $a 621.381046 $2 23
090 $a TK7870.15 $b .E38 2024
111 2 $n (3rd : $d 1998 : $c Amsterdam, Netherlands) $3 194767
245 1 0 $a Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium $h [electronic resource] : $b EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam / $c edited by Nurul Razliana Abdul Razak ... [et al.].
246 3 $a EPITS 2024
260 $a Singapore : $b Springer Nature Singapore : $b Imprint: Springer, $c 2025.
300 $a xiii, 421 p. : $b ill., digital ; $c 24 cm.
490 1 $a Springer proceedings in physics, $x 1867-4941 ; $v 418
505 0 $a Electronic Packaging -- Advanced Materials -- Green Materials -- Surface Coating.
520 $a This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.
650 0 $a Electronic packaging $v Handbooks, manuals, etc. $3 435082
650 0 $a Electronic packaging $x Materials $v Congresses. $3 956419
650 1 4 $a Surface and Interface and Thin Film. $3 920201
650 2 4 $a Green Chemistry. $3 785187
650 2 4 $a Electronic Devices. $3 913118
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Sustainability. $3 376755
700 1 $a Abdul Razak, Nurul Razliana. $3 993265
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer Nature eBook
830 0 $a Springer proceedings in physics ; $v v. 98. $3 440453
856 4 0 $u https://doi.org/10.1007/978-981-96-2871-1
950 $a Physics and Astronomy (SpringerNature-11651)