吳信賢

義工制度的理論與實施 by: 吳信賢; 吳春勇; 吳美慧 (Language materials, printed) , [著]

面板級封裝粗糙度與電熱最佳化研究 = Research on Surface Roughness and Electrothermal Optimization in Panel-Level Packaging by: 吳信賢; 國立高雄大學電機工程學系碩博士班 (Language materials, printed) , [撰]