劉百洲

電路板焊墊設計對於四方扁平露焊墊構裝之焊接可靠度分析研究 = Soldering and Reliability Analysis of PCB Land-pad Design for QFP E-pad Package by: 劉百洲; 國立高雄大學電機工程學系碩士班 (Language materials, printed) , [撰]