趙昱翔

雷射鑽孔反應曲面法與鑽孔型式於改善封裝製程良率之研究 = The Improvement of Yield in Flip Chip Package by Using Response Surface Method of Laser Ablation and Drilling Structure by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 趙昱翔 (書目-語言資料,印刷品) , [撰]