Languages
石晉宇
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
高導熱材料在超細間距覆晶球柵陣列封裝之平面度優化研究 = Effects of High Thermal Compound on the Planarity Optimization of Ultra-Fine Pitch Flip-Chip Ball Grid Array (FCBGA) Packaging
by:
國立高雄大學電機工程學系--半導體製造智能化技術產業碩士專班; 石晉宇
(Language materials, printed)
, [撰]
Subjects