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Wire bonding in microelectronics :ma...

Harman, George G.

Wire bonding in microelectronics :materials, processes, reliability, and yield /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Wire bonding in microelectronics :George G. Harmon.
Reminder of title:	materials, processes, reliability, and yield /
Author:	Harman, George G.
other author:	Harman, George G.
Published:	New York :McGraw-Hill,c1997.
Description:	xiv, 290 p. :ill. ;24 cm.
Notes:	Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Series:	Electronic packaging and interconnection series
Subject:	Wire bonding (Electronic packaging)Production control.
ISBN:	0070326193 :

Wire bonding in microelectronics :materials, processes, reliability, and yield /
Harman, George G.

Wire bonding in microelectronics :materials, processes, reliability, and yield /George G. Harmon. - 2nd ed. - New York :McGraw-Hill,c1997. - xiv, 290 p. :ill. ;24 cm. - Electronic packaging and interconnection series.

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

Includes bibliographical references and index.

ISBN: 0070326193 :NT$1,915

LCCN: 97019652 Subjects--Topical Terms:

182758
Wire bonding (Electronic packaging)
--Production control.

LC Class. No.: TK7836 / H287 1997

Dewey Class. No.: 621.3815

Wire bonding in microelectronics :materials, processes, reliability, and yield /
LDR:00747nam 2200205 a 450 001 143523
005 19980518141856.0
008 090528s1997 nyua 001 0 eng
010 $a 97019652
020 $a 0070326193 : $c NT$1,915
035 $a 00003989
040 $a DLC $c DLC $d DLC
050 0 0 $a TK7836 $b H287 1997
082 0 0 $2 21 $a 621.3815
100 $a Harman, George G. $3 182757
245 1 0 $a Wire bonding in microelectronics : $b materials, processes, reliability, and yield / $c George G. Harmon.
250 $a 2nd ed.
260 $a New York : $c c1997. $b McGraw-Hill,
300 $a xiv, 290 p. : $b ill. ; $c 24 cm.
440 0 $a Electronic packaging and interconnection series
500 $a Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
504 $a Includes bibliographical references and index.
650 $a Wire bonding (Electronic packaging) $x Production control. $3 182758
650 $a Electronic packaging $x Reliabiligy. $3 182759
650 $a Electronic packaging $x Defects. $3 182760
650 $a Semiconductors $x Failure. $3 182761
700 $a Harman, George G. $3 182757