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X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures.

Record Type:	Electronic resources : Monograph/item
Title/Author:	X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures.
Author:	Valek, Bryan Charles.
Description:	134 p.
Notes:	Adviser: John C. Bravman.
Notes:	Source: Dissertation Abstracts International, Volume: 64-09, Section: B, page: 4570.
Contained By:	Dissertation Abstracts International64-09B.
Subject:	Engineering, Materials Science.
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3104171
ISBN:	0496517392

X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures.
Valek, Bryan Charles.

X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures. [electronic resource] - 134 p.

Adviser: John C. Bravman.

Thesis (Ph.D.)--Stanford University, 2003.

Electromigration in metallic interconnect lines is a reliability issue of particular concern to the chip industry and has been the subject of intensive study. The scanning white beam x-ray microdiffraction technique is used to study microstructural evolution in Al(Cu) interconnect lines during in-situ electromigration tests. An unusual mode of plastic deformation has been discovered. The data show plastic deformation and grain rotations occurring under the influence of electromigration. This is seen as broadening, movement, and splitting of Laue reflections diffracted from individual metal grains. Gradients in the plastic deformation behavior are seen along the length of a line, decreasing from the cathode towards the anode. A model for this unexpected behavior has been developed. The model states that stress that arises due to diffusion of vacancies into the grains from interfaces and grain boundaries is relieved by the introduction and motion of dislocations from the bottom surface of the interconnect. The model accounts for the observed concave deformation and grain rotations seen within a line.

ISBN: 0496517392Subjects--Topical Terms:

226940
Engineering, Materials Science.

X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures.
LDR:03388nmm _2200277 _450 001 162153
005 20051017073416.5
008 230606s2003 eng d
020 $a 0496517392
035 $a 00148654
035 $a 162153
040 $a UnM $c UnM
100 0 $a Valek, Bryan Charles. $3 227269
245 1 0 $a X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures. $h [electronic resource]
300 $a 134 p.
500 $a Adviser: John C. Bravman.
500 $a Source: Dissertation Abstracts International, Volume: 64-09, Section: B, page: 4570.
502 $a Thesis (Ph.D.)--Stanford University, 2003.
520 # $a Electromigration in metallic interconnect lines is a reliability issue of particular concern to the chip industry and has been the subject of intensive study. The scanning white beam x-ray microdiffraction technique is used to study microstructural evolution in Al(Cu) interconnect lines during in-situ electromigration tests. An unusual mode of plastic deformation has been discovered. The data show plastic deformation and grain rotations occurring under the influence of electromigration. This is seen as broadening, movement, and splitting of Laue reflections diffracted from individual metal grains. Gradients in the plastic deformation behavior are seen along the length of a line, decreasing from the cathode towards the anode. A model for this unexpected behavior has been developed. The model states that stress that arises due to diffusion of vacancies into the grains from interfaces and grain boundaries is relieved by the introduction and motion of dislocations from the bottom surface of the interconnect. The model accounts for the observed concave deformation and grain rotations seen within a line.
520 # $a The capabilities of the x-ray microdiffraction technique are demonstrated by studying the local microstructural and mechanical properties of Al (0.5wt.% Cu) thin film structures. Maps of local grain structure, orientation, and deviatoric stress in 4.1 and 0.7 pin wide passivated interconnect lines show highly inhomogeneous local properties. Thermal cycling of an Al(Cu) bond pad provides insight into the relation between local and macroscopic stresses.
520 # $a We present the development of an x-ray diffraction technique with submicron spatial resolution for the study of thin film structures. This technique is known as scanning white beam x-ray microdiffraction. A polychromatic synchrotron x-ray beam (energy range: 6--14 keV) is focused to a 0.8 x 0.8 mum spot using elliptically bent platinum mirrors in a Kirkpatrick-Baez configuration. Data are collected via a CCD in the form of Laue diffraction patterns from individual grains within the x-ray spot. Translation of the sample within the focal plane of the x-rays allows for the spatial mapping of grain orientation, grain structure, and deviatoric strain/stress within the sample. Data analysis techniques for the rapid analysis, indexing, and strain refinement of multiple Laue patterns are also presented.
590 $a School code: 0212.
650 # 0 $a Engineering, Materials Science. $3 226940
650 # 0 $a Engineering, Metallurgy. $3 227093
710 0 # $a Stanford University. $3 212607
773 0 # $g 64-09B. $t Dissertation Abstracts International
790 $a 0212
790 1 0 $a Bravman, John C., $e advisor
791 $a Ph.D.
792 $a 2003
856 4 0 $u http://libsw.nuk.edu.tw/login?url=http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3104171 $z http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3104171