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應用六標準差方法改善晶圓製程之外觀缺陷率－以F廠為例 = Applyin...

國立高雄大學亞太工商管理學系碩士班

應用六標準差方法改善晶圓製程之外觀缺陷率－以F廠為例 = Applying the Six Sigma Approach to Improve the Surface Defect Rate of the Wafer Process: A Case Study of F Fab

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	Applying the Six Sigma Approach to Improve the Surface Defect Rate of the Wafer Process: A Case Study of F Fab
作者:	蔡宗勳,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2012[民101]
面頁冊數:	53面圖，表 : 30公分;
標題:	六標準差
標題:	Six Sigma
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/32021225664071558667
附註:	參考書目：面51-53
摘要註:	隨著製造技術的進步，現代人對於品質的要求已不再只限於產品的功能而已，針對產品的外觀及售後服務等，亦是產品品質重要的一部分。因此，產品製造業者必須耗費更多的心力來維持進而提升包含產品功能、外觀之品質，於是許多具備系統化及持續性的品質改善手法便應運而生，其中六標準差改善手法即是具代表性的一個。本研究應用六標準差方法之DMAIC改善流程，即定義(D)、衡量(M)、分析(A)、改善(I)及控制(C)五大步驟，針對本研究所探討的個案-晶圓製程之外觀缺陷率改善進行相關活動，並在改善階段運用田口實驗設計法執行製程參數最佳化，將影響外觀缺陷率之關鍵製程其參數調整至最佳狀態，並由變異數分析檢定得到最佳化之參數達到顯著差異。最後改善後的外觀缺陷率具明顯下降的趨勢，也驗證了改善結果的有效性。 With the progress of the manufacturing technology, the quality requirement for the people nowadays is no longer limited to the product function. It is also considered important for the concerns such as product appearances and after-sales service. Therefore, manufacturers must put more efforts to maintain or even upgrade the functions, features and appearances of their products. To meet these needs, the Six Sigma Approach has become one of the representatives among the methods that focus on systematic and continuous quality improvement. This study employed the DMAIC improvement process of the Six Sigma Approach, e.g. Definition (D), Measurement (M), Analyze (A), Improvement (I) and Control (C). To improve the surface defect rate of the wafer process, some related activities for the case in this study were conducted. In addition, in the phase of improvement, the Taguchi DOE Method was utilized to execute the optimization of the process parameters. It was hoped to adjust the parameters of the critical process that affected the surface defect rate. Besides, the significant differences of the optimized parameters were reached according to the results of ANOVA. Finally, the obvious decrease of the surface rate verified the effectiveness of the improvement in this study.

應用六標準差方法改善晶圓製程之外觀缺陷率－以F廠為例 = Applying the Six Sigma Approach to Improve the Surface Defect Rate of the Wafer Process: A Case Study of F Fab
蔡, 宗勳

應用六標準差方法改善晶圓製程之外觀缺陷率－以F廠為例 = Applying the Six Sigma Approach to Improve the Surface Defect Rate of the Wafer Process: A Case Study of F Fab / 蔡宗勳撰 - [高雄市] : 撰者, 2012[民101]. - 53面 ; 圖，表 ; 30公分.
參考書目：面51-53.
六標準差Six Sigma

應用六標準差方法改善晶圓製程之外觀缺陷率－以F廠為例 = Applying the Six Sigma Approach to Improve the Surface Defect Rate of the Wafer Process: A Case Study of F Fab
LDR:03479nam0a2200277 450 001 322904
005 20170214100933.0
009 322904
010 0 $b 精裝
010 0 $b 平裝
100 $a 20170214y2012 k y0chiy50 e
101 1 $a chi $d chi $d eng
102 $a tw
105 $a ak am 000yy
200 1 $a 應用六標準差方法改善晶圓製程之外觀缺陷率－以F廠為例 $d Applying the Six Sigma Approach to Improve the Surface Defect Rate of the Wafer Process: A Case Study of F Fab $z eng $f 蔡宗勳撰
210 $a [高雄市] $c 撰者 $d 2012[民101]
215 0 $a 53面 $c 圖，表 $d 30公分
300 $a 參考書目：面51-53
314 $a 指導教授：盧昆宏博士
328 $a 碩士論文--國立高雄大學亞太工商管理學系碩士班
330 $a 隨著製造技術的進步，現代人對於品質的要求已不再只限於產品的功能而已，針對產品的外觀及售後服務等，亦是產品品質重要的一部分。因此，產品製造業者必須耗費更多的心力來維持進而提升包含產品功能、外觀之品質，於是許多具備系統化及持續性的品質改善手法便應運而生，其中六標準差改善手法即是具代表性的一個。本研究應用六標準差方法之DMAIC改善流程，即定義(D)、衡量(M)、分析(A)、改善(I)及控制(C)五大步驟，針對本研究所探討的個案-晶圓製程之外觀缺陷率改善進行相關活動，並在改善階段運用田口實驗設計法執行製程參數最佳化，將影響外觀缺陷率之關鍵製程其參數調整至最佳狀態，並由變異數分析檢定得到最佳化之參數達到顯著差異。最後改善後的外觀缺陷率具明顯下降的趨勢，也驗證了改善結果的有效性。 With the progress of the manufacturing technology, the quality requirement for the people nowadays is no longer limited to the product function. It is also considered important for the concerns such as product appearances and after-sales service. Therefore, manufacturers must put more efforts to maintain or even upgrade the functions, features and appearances of their products. To meet these needs, the Six Sigma Approach has become one of the representatives among the methods that focus on systematic and continuous quality improvement. This study employed the DMAIC improvement process of the Six Sigma Approach, e.g. Definition (D), Measurement (M), Analyze (A), Improvement (I) and Control (C). To improve the surface defect rate of the wafer process, some related activities for the case in this study were conducted. In addition, in the phase of improvement, the Taguchi DOE Method was utilized to execute the optimization of the process parameters. It was hoped to adjust the parameters of the critical process that affected the surface defect rate. Besides, the significant differences of the optimized parameters were reached according to the results of ANOVA. Finally, the obvious decrease of the surface rate verified the effectiveness of the improvement in this study.
510 1 $a Applying the Six Sigma Approach to Improve the Surface Defect Rate of the Wafer Process: A Case Study of F Fab $z eng
610 0 $a 六標準差 $a DMAIC $a 外觀缺陷率 $a 田口實驗設計法
610 1 $a Six Sigma $a DMAIC $a surface defect rate $a the Taguchi DOE Method
681 $a 008M/0019 $b 343425 4432.1 $v 2007年版
700 1 $a 蔡 $b 宗勳 $4 撰 $3 546929
712 0 2 $a 國立高雄大學 $b 亞太工商管理學系碩士班 $3 166023
801 0 $a tw $b NUK $c 20120503 $g CCR
856 7 $z 電子資源 $2 http $u http://handle.ncl.edu.tw/11296/ndltd/32021225664071558667