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應用QFD與FMEA提昇基板封裝設計績效之研究 = Research f...

國立高雄大學亞太工商管理學系碩士班

應用QFD與FMEA提昇基板封裝設計績效之研究 = Research for QFD and FMEA application for raising substrate package design performance

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	Research for QFD and FMEA application for raising substrate package design performance
作者:	黃詔卿,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2013[民102]
面頁冊數:	90面圖，表格 : 30公分;
標題:	品質機能展開
標題:	Quality Function Deployment
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/51545906302001354556
附註:	參考書目：面79-82
附註:	102年10月31日公開
摘要註:	摘要基板為日常生活中各式各樣的電子產品中不可或缺的零組件。基板的功能為晶片(wafer)與印刷電路板(Printed Circuit Board，PCB)間之訊號連結的載體，透過電路佈局、封裝、測試等流程，產出顧客所需之電子產品。基板從最初設計經製造、包裝、出貨等過程，這過程包含了可能設計不良、人員的疏忽及一些不確定因素，造成後續產品的不良率發生，進而造成延誤到交期或因產品的不良而產生客訴或危害。鑒於提昇基板設計之品質、速度、交期、良率、成本等效益，本研究擬利用品質機能展開(Quality Function Deployment，QFD)及失效模式與失效模式與效應分析(Failure Mode & Effect Analysis，FMEA)於新基板於最初設計階段時，進行預防及避免基板已佈局設計完成後，因後續的封裝製程疏忽造成不能經由重工(rework)修復不良品的現象發生，導致成本損失及錯失大量訂單的機會。新產品之基板於研發設計階段，往往因有許多不確定因素需陸續修改。有時因頻繁修改，影響後續製程及下線生產的時間，進而導致影響交期。本研究結果盼能縮短產品的前置時間、減少修改次數、避免產生不良品、提高良率，以增進新產品的競爭機會及爭取更大的獲利空間。關鍵字:品質機能展開、失效模式與效應分析、基板設計 AbstractSubstrate is an integral component of the various electronic products in our daily life. Being the carrier of the signal connection between the wafer and the PCB, substrate helps manufacture electronic products to meet customers’ needs through the processes of circuit layout, packaging, and testing. During the process of substrate’s design, manufacture, packaging, and shipping, the possible design flaws, staff’s personal mistakes, and some other unexpected factors might cause the defects of the captive products. Consequently, not only a delivery delay might happen but those defective products might lead to customer complaints or product damage. To promote the substrate design in quality, speed, delivery time, yield rate, and cost, this study attempts to apply Quality Function Deployment (QFD) and Failure Mode & Effect Analysis (FMEA) to the initial stage of the substrate design. It is expected to prevent the designed substrates from being unable to rework the defective products caused by the faulty package that might result in the losses of the production cost and the order quantity. During the stage of innovation research on new products, continuous corrections are inevitable due to some uncertain factors, which sometimes delay the follow-up procedures as well as the production, and even the delivery time. It is hoped that this study will contribute to the new product’s competitiveness and profit by providing the ways of shortening the pre-production time, decreasing the correction needs, avoiding defective production, and increasing the yield rate.Keywords: Quality Function Deployment, Failure Mode & Effect Analysis, substrate design

應用QFD與FMEA提昇基板封裝設計績效之研究 = Research for QFD and FMEA application for raising substrate package design performance
黃, 詔卿

應用QFD與FMEA提昇基板封裝設計績效之研究 = Research for QFD and FMEA application for raising substrate package design performance / 黃詔卿撰 - [高雄市] : 撰者, 2013[民102]. - 90面 ; 圖，表格 ; 30公分.
參考書目：面79-82102年10月31日公開.
品質機能展開Quality Function Deployment

應用QFD與FMEA提昇基板封裝設計績效之研究 = Research for QFD and FMEA application for raising substrate package design performance
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