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More-than-Moore 2.5D and 3D SiP inte...

Radojcic, Riko.

More-than-Moore 2.5D and 3D SiP integration

Record Type:	Electronic resources : Monograph/item
Title/Author:	More-than-Moore 2.5D and 3D SiP integrationby Riko Radojcic.
Author:	Radojcic, Riko.
Published:	Cham :Springer International Publishing :2017.
Description:	xv, 182 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Embedded computer systems.
Online resource:	http://dx.doi.org/10.1007/978-3-319-52548-8
ISBN:	9783319525488$q(electronic bk.)

More-than-Moore 2.5D and 3D SiP integration
Radojcic, Riko.

More-than-Moore 2.5D and 3D SiP integration[electronic resource] /by Riko Radojcic. - Cham :Springer International Publishing :2017. - xv, 182 p. :ill., digital ;24 cm.

Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

ISBN: 9783319525488$q(electronic bk.)

Standard No.: 10.1007/978-3-319-52548-8doiSubjects--Topical Terms:

184402
Embedded computer systems.

LC Class. No.: TK7895.E42

Dewey Class. No.: 006.22

More-than-Moore 2.5D and 3D SiP integration
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520 $a This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
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