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適用於封裝產業全廠機台批間機況監控系統實作 = Implementati...

劉益銘

適用於封裝產業全廠機台批間機況監控系統實作 = Implementation of Factory-wide Equipment Status Between Lot to Lot Monitoring System for Packaging Industry

Record Type:	Language materials, printed : monographic
Paralel Title:	Implementation of Factory-wide Equipment Status Between Lot to Lot Monitoring System for Packaging Industry
Author:	劉益銘,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	高雄市
Published:	國立高雄大學;
Year of Publication:	2021[民110]
Description:	xii,83葉圖，表 : 30公分;
Subject:	半導體封裝產業
Subject:	Semiconductor packaging industry
Online resource:	https://hdl.handle.net/11296/6gwm59
Notes:	110年12月1日公開
Notes:	參考書目：葉70-71

適用於封裝產業全廠機台批間機況監控系統實作 = Implementation of Factory-wide Equipment Status Between Lot to Lot Monitoring System for Packaging Industry
劉, 益銘

適用於封裝產業全廠機台批間機況監控系統實作 = Implementation of Factory-wide Equipment Status Between Lot to Lot Monitoring System for Packaging Industry / 劉益銘撰 - 高雄市 : 國立高雄大學, 2021[民110]. - xii,83葉 ; 圖，表 ; 30公分.
110年12月1日公開參考書目：葉70-71.
半導體封裝產業Semiconductor packaging industry

適用於封裝產業全廠機台批間機況監控系統實作 = Implementation of Factory-wide Equipment Status Between Lot to Lot Monitoring System for Packaging Industry
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