國立高雄大學圖資館 |

Language: English

Back

Silicon sensors and actuatorsthe feynman roadmap /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Silicon sensors and actuatorsedited by Benedetto Vigna ... [et al.].
Reminder of title:	the feynman roadmap /
other author:	Vigna, Benedetto.
Published:	Cham :Springer International Publishing :2022.
Description:	xiii, 997 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer Nature eBook
Subject:	Silicon diodes.
Online resource:	https://doi.org/10.1007/978-3-030-80135-9
ISBN:	9783030801359$q(electronic bk.)

Silicon sensors and actuatorsthe feynman roadmap /
Silicon sensors and actuatorsthe feynman roadmap /[electronic resource] :edited by Benedetto Vigna ... [et al.]. - Cham :Springer International Publishing :2022. - xiii, 997 p. :ill. (some col.), digital ;24 cm.

1. Silicon as Sensor Material -- 2. Epitaxial Growth -- 3. Thin Film Deposition -- 4. Thin Films Characterization & Metrology -- 5. Dry silicon etch -- 6. Lithography -- 7. HF Release -- 8. Galvanic growth -- 9. Wet Etch and Cleaning -- 10. Piezoelectric materials -- 11. Wafer to wafer Bonding -- 12. Linear and non linear mechanichs in MEMS -- 13. Inertial sensors -- 14. Magnetometer -- 15. MEMS microphones -- 16. Pressure Sensors -- 17. Enviromental Sensors -- 18. Mirror -- 19. Piezo ink jet printers -- 20. Speakers -- 21. Autofocus -- 22. Electronic sensors front-end -- 23. Electronic Interfaces for actuators -- 24. Package -- 25. Testing -- 26. Reliability -- 27. The future of sensor and actuators.

This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman's visionary talk "There is Plenty of Room at the Bottom" to propose that the time has come to see silicon sensors as part of a "Feynman Roadmap" instead of the "More-than-Moore" technology roadmap. The sharing of the author's industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.

ISBN: 9783030801359$q(electronic bk.)

Standard No.: 10.1007/978-3-030-80135-9doiSubjects--Topical Terms:

339852
Silicon diodes.

LC Class. No.: TK7871.86 / .S55 2022

Dewey Class. No.: 621.381522

Silicon sensors and actuatorsthe feynman roadmap /
LDR:02867nmm a2200325 a 4500 001 621016
003 DE-He213
005 20220425185051.0
006 m d
007 cr nn 008maaau
008 221121s2022 sz s 0 eng d
020 $a 9783030801359$q(electronic bk.)
020 $a 9783030801342$q(paper)
024 7 $a 10.1007/978-3-030-80135-9 $2 doi
035 $a 978-3-030-80135-9
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7871.86 $b .S55 2022
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381522 $2 23
090 $a TK7871.86 $b .S583 2022
245 0 0 $a Silicon sensors and actuators $h [electronic resource] : $b the feynman roadmap / $c edited by Benedetto Vigna ... [et al.].
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2022.
300 $a xiii, 997 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a 1. Silicon as Sensor Material -- 2. Epitaxial Growth -- 3. Thin Film Deposition -- 4. Thin Films Characterization & Metrology -- 5. Dry silicon etch -- 6. Lithography -- 7. HF Release -- 8. Galvanic growth -- 9. Wet Etch and Cleaning -- 10. Piezoelectric materials -- 11. Wafer to wafer Bonding -- 12. Linear and non linear mechanichs in MEMS -- 13. Inertial sensors -- 14. Magnetometer -- 15. MEMS microphones -- 16. Pressure Sensors -- 17. Enviromental Sensors -- 18. Mirror -- 19. Piezo ink jet printers -- 20. Speakers -- 21. Autofocus -- 22. Electronic sensors front-end -- 23. Electronic Interfaces for actuators -- 24. Package -- 25. Testing -- 26. Reliability -- 27. The future of sensor and actuators.
520 $a This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman's visionary talk "There is Plenty of Room at the Bottom" to propose that the time has come to see silicon sensors as part of a "Feynman Roadmap" instead of the "More-than-Moore" technology roadmap. The sharing of the author's industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
650 0 $a Silicon diodes. $3 339852
650 0 $a Actuators. $3 224320
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Microsystems and MEMS. $3 913236
650 2 4 $a Electronic Circuits and Systems. $3 913394
650 2 4 $a Materials Engineering. $3 682881
700 1 $a Vigna, Benedetto. $3 922023
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer Nature eBook
856 4 0 $u https://doi.org/10.1007/978-3-030-80135-9
950 $a Engineering (SpringerNature-11647)