國立高雄大學圖資館 |

登入

回首頁

Embedded cooling of electronic devicesconduction, evaporation, and single- and two-phase convection /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Embedded cooling of electronic deviceseditors, Madhusudan Iyengar, Justin A Weibel, Mehdi Asheghi.
其他題名:	conduction, evaporation, and single- and two-phase convection /
其他作者:	Iyengar, Madhusudan.
出版者:	Singapore :World Scientific,c2024.
面頁冊數:	1 online resource (xiii, 464 p.) :ill. (some col.)
標題:	Electronic apparatus and appliancesCooling.
電子資源:	https://www.worldscientific.com/worldscibooks/10.1142/13458#t=toc
ISBN:	9789811279379$q(ebook for institutions)

Embedded cooling of electronic devicesconduction, evaporation, and single- and two-phase convection /
Embedded cooling of electronic devicesconduction, evaporation, and single- and two-phase convection /[electronic resource] :editors, Madhusudan Iyengar, Justin A Weibel, Mehdi Asheghi. - 1st ed. - Singapore :World Scientific,c2024. - 1 online resource (xiii, 464 p.) :ill. (some col.) - WSPC series in advanced integration and packaging,vol. 82315-473X ;. - WSPC series in advanced integration and packaging,vol. 8..

Includes bibliographical references and index.

Compact thermal modeling of emerging cooling technologies for processors / Zihao Yuan, Sherief Reda, and Ayse K. Coskun.

"This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues. The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics. This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required"--

ISBN: 9789811279379$q(ebook for institutions)Subjects--Topical Terms:

782171
Electronic apparatus and appliances
--Cooling.

LC Class. No.: TK7870.25 / .E45 2024

Dewey Class. No.: 621.381

Embedded cooling of electronic devicesconduction, evaporation, and single- and two-phase convection /
LDR:02409cmm a2200289 a 4500 001 682263
005 20251017072503.0
006 m o d
007 cr cnu---unuuu
008 251202s2024 njua ob 001 0 eng
020 $a 9789811279379$q(ebook for institutions)
020 $a 9789811279386$q(ebook for individuals)
020 $z 9789811277931$q(hardcover)
035 $a 9789811279379
040 $a DLC $b eng $c DLC
041 0 $a eng
050 0 0 $a TK7870.25 $b .E45 2024
082 0 0 $a 621.381 $2 23
245 0 0 $a Embedded cooling of electronic devices $h [electronic resource] : $b conduction, evaporation, and single- and two-phase convection / $c editors, Madhusudan Iyengar, Justin A Weibel, Mehdi Asheghi.
250 $a 1st ed.
260 $a Singapore : $b World Scientific, $c c2024.
300 $a 1 online resource (xiii, 464 p.) : $b ill. (some col.)
490 1 $a WSPC series in advanced integration and packaging, $x 2315-473X ; $v vol. 8
504 $a Includes bibliographical references and index.
505 2 $a Compact thermal modeling of emerging cooling technologies for processors / Zihao Yuan, Sherief Reda, and Ayse K. Coskun.
520 $a "This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues. The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics. This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required"-- $c Provided by publisher.
588 $a Description based on print version record.
650 0 $a Electronic apparatus and appliances $x Cooling. $3 782171
650 0 $a Microfluidic devices. $3 397760
650 0 $a Heat $x Conduction. $3 675294
650 0 $a Heat $x Convection. $3 225447
650 0 $a Electronic packaging. $3 182161
700 1 $a Iyengar, Madhusudan. $3 811637
700 1 $a Weibel, Justin A. $3 995899
700 1 $a Asheghi, Mehdi. $3 995900
830 0 $a WSPC series in advanced integration and packaging, $x 2315-473X ; $v vol. 8. $3 995901
856 4 0 $u https://www.worldscientific.com/worldscibooks/10.1142/13458#t=toc