| Record Type: |
Electronic resources
: monographic
|
| Paralel Title: |
Wafer foundry and advanced packaging technologies : industrial practices and applications |
| Author: |
曲建仲, |
| Secondary Intellectual Responsibility: |
凌網知識股份有限公司 |
| Place of Publication: |
[臺北市] |
| Published: |
知識力科技; 全華圖書; |
| Year of Publication: |
2025[民114] |
| Edition: |
二版 |
| Description: |
294面彩圖, 表 : |
| Series: |
跨領域科技素養教育系列課程1 |
| Subject: |
半導體 - |
| Subject: |
工程材料 - |
| Subject: |
半導體工業 - |
| Online resource: |
https://nuk.ebook.hyread.com.tw/bookDetail.jsp?id=474190 |
| Notes: |
資料型式: 文字 |
| Notes: |
檢索型式: 電子書服務平台 |
| Notes: |
系統需求: HyRead Library |
| ISBN: |
978-626-401-573-8 |