Electronic packaging.
Overview
| Works: | 23 works in 7 publications in 7 languages | |
|---|---|---|
Titles
Surface mount technology for concurrent engineering and manufacturing /
by:
(Language materials, printed)
Modern solder technology for competitive electronics manufacturing /
by:
(Language materials, printed)
Package electrical modeling, thermal modeling, and processing for GaAs wireless applications /
by:
(Language materials, printed)
Lead-free soldering in electronicsscience, technology and environmental impact /
by:
(Electronic resources)
Power electronic packagingdesign, assembly process, reliability and modeling /
by:
(Electronic resources)
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
by:
(Language materials, printed)
Embedded cooling of electronic devicesconduction, evaporation, and single- and two-phase convection /
by:
(Electronic resources)
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