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書目資訊
主題
Multichip modules (Microelectronics) - Design and construction.
概要
作品:
8 作品在 3 項出版品 3 種語言
書目資訊
Thermal management handbook :for electronic assemblies /
by:
(書目-語言資料,印刷品)
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
by:
(書目-語言資料,印刷品)
Advanced electronic packaging :with emphasis on multichip modules /
by:
(書目-語言資料,印刷品)
System-in-package RF design and applications /
by:
(書目-語言資料,印刷品)
Introduction to system-on-package (SOP) :miniaturization of the entire system /
by:
(書目-語言資料,印刷品)
Introduction to system-on-package (SOP) :miniaturization of the entire system /
by:
(書目-語言資料,印刷品)
SiP system-in-package design and simulationmentor EE flow advanced design guide /
by:
(書目-電子資源)
MicroSystem based on SiP technology
by:
(書目-電子資源)
主題
Semiconductors.
Electronic apparatus and appliances
Electronics and Microelectronics, Instrumentation.
Radio frequency integrated circuits
Multichip modules (Microelectronics)
Electronic packaging.
Microelectronic packaging.
Integrated circuits
Industrial and Production Engineering.
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