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Low cost flip chip technologies :for...
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Lau, John H.
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Low cost flip chip technologies :John H. Lau.
Reminder of title:
for DCA, WLCSP, and PBGA assemblies /
Author:
Lau, John H.
Published:
New York :McGraw-Hill,c2000.
Description:
xxii, 585 p. :ill. ;24 cm.
Subject:
Multichip modules (Microelectronics)Design and construction.
ISBN:
0071351418 :
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
Lau, John H.
Low cost flip chip technologies :
for DCA, WLCSP, and PBGA assemblies /John H. Lau. - New York :McGraw-Hill,c2000. - xxii, 585 p. :ill. ;24 cm.
Includes bibliographical references and index.
ISBN: 0071351418 :NT$3078
LCCN: 99088307 Subjects--Topical Terms:
185545
Multichip modules (Microelectronics)
--Design and construction.
LC Class. No.: TK7874 / L366 2000
Dewey Class. No.: 621.3815
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
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Low cost flip chip technologies :
$b
for DCA, WLCSP, and PBGA assemblies /
$c
John H. Lau.
260
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New York :
$c
c2000.
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McGraw-Hill,
300
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xxii, 585 p. :
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ill. ;
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24 cm.
504
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Includes bibliographical references and index.
650
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Multichip modules (Microelectronics)
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Design and construction.
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185545
650
$a
Microelectronic packaging.
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182088
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320000141210
西方語文圖書區(四樓)
1圖書
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TK7874 L366 2000
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1 records • Pages 1 •
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