Lau, John H.
概要
| 作品: | 1 作品在 8 項出版品 1 種語言 | |
|---|---|---|
書目資訊
Chip scale package (CSP) :design, materials, processes, reliability, and applications /
by:
Lau, John H.; Lee, Shi-Wei Ricky.
(書目-語言資料,印刷品)
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
by:
Lau, John H.
(書目-語言資料,印刷品)
Flip chip, hybrid bonding, fan-in, and fan-out technology
by:
Lau, John H.; SpringerLink (Online service)
(書目-電子資源)
Electronics manufacturing :with lead-free, halogen-free, and conductive-adhesive materials /
by:
Lau, John H.
(書目-語言資料,印刷品)
Chiplet design and heterogeneous integration packaging
by:
Lau, John H.; SpringerLink (Online service)
(書目-電子資源)
Assembly and reliability of lead-free solder joints
by:
Lau, John H.; Lee, Ning-Cheng.; SpringerLink (Online service)
(書目-電子資源)
更多
較少的
主題
Ball grid array technology.
Semiconductors.
Laser Technology.
Microelectromechanical systems.
Solder and soldering.
Joints (Engineering)
Interconnects (Integrated circuit technology)
Electronic Devices.
Electronic apparatus and appliances
Electronics and Microelectronics, Instrumentation.
Microsystems and MEMS.
Multichip modules (Microelectronics)
Circuits and Systems.
Optics and Photonics.
Chip scale packaging.
Nanotechnology and Microengineering.
Microelectronic packaging.
Green products.
Engineering.
Optical and Electronic Materials.
Semiconductors
Electronic Circuits and Systems.
Environmental protection.
Integrated circuits
Integrated circuits.
Electronic Circuits and Devices.
Industrial and Production Engineering.