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RF and Microwave Microelectronics Pa...

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Cahill, Sean S.

RF and Microwave Microelectronics Packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	RF and Microwave Microelectronics Packagingedited by Ken Kuang, Franklin Kim, Sean S. Cahill.
other author:	Kim, Franklin.
Published:	Boston, MA :Springer Science+Business Media, LLC,2010.
Description:	xiv, 284 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Microelectronic packaging.
Online resource:	http://dx.doi.org/10.1007/978-1-4419-0984-8
ISBN:	9781441909848 (electronic bk.)

RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging[electronic resource] /edited by Ken Kuang, Franklin Kim, Sean S. Cahill. - Boston, MA :Springer Science+Business Media, LLC,2010. - xiv, 284 p. :ill., digital ;24 cm.

ISBN: 9781441909848 (electronic bk.)Subjects--Topical Terms:

182088
Microelectronic packaging.

Dewey Class. No.: 621.381046

RF and Microwave Microelectronics Packaging
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003 Springer
005 20100709172945.0
006 m d
007 cr nn 008maaau
008 100818s2010 mau s j eng d
020 $a 9781441909848 (electronic bk.)
020 $a 9781441909831 (paper)
035 $a 978-1-4419-0983-1
082 0 4 $a 621.381046 $2 22
090 $a TK7874 $b .R467 2010
245 0 0 $a RF and Microwave Microelectronics Packaging $h [electronic resource] / $c edited by Ken Kuang, Franklin Kim, Sean S. Cahill.
260 $a Boston, MA : $b Springer Science+Business Media, LLC, $c 2010.
300 $a xiv, 284 p. : $b ill., digital ; $c 24 cm.
650 0 $a Microelectronic packaging. $3 182088
650 2 4 $a Circuits and Systems $3 253885
650 2 4 $a Microwaves, RF and Optical Engineering $3 252528
650 2 4 $a Electronics and Microelectronics, Instrumentation $3 252956
650 1 4 $a Engineering $3 252507
700 1 $a Kim, Franklin. $3 455861
700 1 $a Kuang, Ken. $3 455859
700 1 $a Cahill, Sean S. $3 455860
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-1-4419-0984-8
950 $a Engineering (Springer-11647)

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000000040623

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EB TK7874 2010

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http://dx.doi.org/10.1007/978-1-4419-0984-8

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