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Microelectronic packaging.
概要
作品:
25 作品在 9 項出版品 9 種語言
書目資訊
Multichip module technology handbook /
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(書目-語言資料,印刷品)
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
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(書目-語言資料,印刷品)
Fundamentals of microfabrication :the science of miniaturization /
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(書目-語言資料,印刷品)
Optoelectronic packaging /
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(書目-語言資料,印刷品)
Area array packaging handbook /
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(書目-語言資料,印刷品)
IC component sockets /
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(書目-電子資源)
IC component sockets /
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(書目-語言資料,印刷品)
Advanced electronic packaging :with emphasis on multichip modules /
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(書目-語言資料,印刷品)
Advanced electronic packaging.
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(書目-語言資料,印刷品)
Chip scale package (CSP) :design, materials, processes, reliability, and applications /
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(書目-語言資料,印刷品)
Microelectronic packaging /
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(書目-語言資料,印刷品)
RF measurements of die and packages /
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(書目-語言資料,印刷品)
Introduction to system-on-package (SOP) :miniaturization of the entire system /
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(書目-語言資料,印刷品)
Materials for advanced packaging
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(書目-電子資源)
Introduction to system-on-package (SOP) :miniaturization of the entire system /
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(書目-語言資料,印刷品)
Quantum-well laser array packaging :nanoscale packaging techniques /
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(書目-語言資料,印刷品)
Advanced MEMS packaging
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(書目-電子資源)
RF and Microwave Microelectronics Packaging
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(書目-電子資源)
Introduction to microsystem packaging technology /
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(書目-語言資料,印刷品)
Bio and nano packaging techniques for electron devicesadvances in electronic device packaging /
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(書目-電子資源)
RF and microwave microelectronics packaging II
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(書目-電子資源)
Die-attach materials for high temperature applications in microelectronics packagingmaterials, processes, equipment, and reliability /
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(書目-電子資源)
Substrate integrated antennas and arrays /
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(書目-語言資料,印刷品)
Fundamentals of device and systems packaging :technologies and applications /
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(書目-語言資料,印刷品)
Chiplet design and heterogeneous integration packaging
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(書目-電子資源)
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主題
Optoelectronic devices.
Ball grid array technology.
Microwaves, RF and Optical Engineering
Electronics and Microelectronics, Instrumentation
Microwaves, RF and Optical Engineering.
Microstrip antennas.
Electric connectors.
Printed circuits
Radio measurements.
Nanotechnology.
Nanoscience.
High power lasers.
Microelectromechanical systems.
Microelectronics.
Machining.
Integrated optics.
Material Science.
Electronics and Microelectronics, Instrumentation.
Circuits and Systems
Materials Engineering.
Lasers
Microsystems and MEMS.
Multichip modules (Microelectronics)
Packaging
Materials Science.
Circuits and Systems.
Metallic Materials.
Quantum wells.
Microelectronic packaging.
Very high speed integrated circuits
Optical and Electronic Materials.
Engineering
Characterization and Evaluation of Materials.
Engineering.
Electronic Circuits and Systems.
Integrated circuits
Microelectromechanical systems
Quality Control, Reliability, Safety and Risk.
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