國立高雄大學圖資館 |

Language: English

Back

Assembly and reliability of lead-fre...

Lau, John H.

Assembly and reliability of lead-free solder joints

Record Type:	Electronic resources : Monograph/item
Title/Author:	Assembly and reliability of lead-free solder jointsby John H. Lau, Ning-Cheng Lee.
Author:	Lau, John H.
other author:	Lee, Ning-Cheng.
Published:	Singapore :Springer Singapore :2020.
Description:	xxi, 527 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Solder and soldering.
Online resource:	https://doi.org/10.1007/978-981-15-3920-6
ISBN:	9789811539206$q(electronic bk.)

Assembly and reliability of lead-free solder joints
Lau, John H.

Assembly and reliability of lead-free solder joints[electronic resource] /by John H. Lau, Ning-Cheng Lee. - Singapore :Springer Singapore :2020. - xxi, 527 p. :ill., digital ;24 cm.

Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

ISBN: 9789811539206$q(electronic bk.)

Standard No.: 10.1007/978-981-15-3920-6doiSubjects--Topical Terms:

182496
Solder and soldering.

LC Class. No.: TS610 / .L385 2020

Dewey Class. No.: 671.56

Assembly and reliability of lead-free solder joints
LDR:02161nmm a2200325 a 4500 001 579715
003 DE-He213
005 20200928151423.0
006 m
007 cr
008 201229s2020
020 $a 9789811539206$q(electronic bk.)
020 $a 9789811539190$q(paper)
024 7 $a 10.1007/978-981-15-3920-6 $2 doi
035 $a 978-981-15-3920-6
040 $a GP $c GP
041 0 $a eng
050 4 $a TS610 $b .L385 2020
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 671.56 $2 23
090 $a TS610 $b .L366 2020
100 1 $a Lau, John H. $3 205101
245 1 0 $a Assembly and reliability of lead-free solder joints $h [electronic resource] / $c by John H. Lau, Ning-Cheng Lee.
260 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2020.
300 $a xxi, 527 p. : $b ill., digital ; $c 24 cm.
505 0 $a Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.
520 $a This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
650 0 $a Solder and soldering. $3 182496
650 0 $a Joints (Engineering) $3 210854
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Circuits and Systems. $3 274416
700 1 $a Lee, Ning-Cheng. $3 665505
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u https://doi.org/10.1007/978-981-15-3920-6
950 $a Engineering (Springer-11647)