國立高雄大學圖資館 |

語系: 繁體中文

說明(常見問題)

圖資館首頁

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Semiconductor advanced packaging

Lau, John H.

Semiconductor advanced packaging

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Semiconductor advanced packagingby John H. Lau.
作者:	Lau, John H.
出版者:	Singapore :Springer Singapore :2021.
面頁冊數:	xxii, 498 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	SemiconductorsDesign and construction.
電子資源:	https://doi.org/10.1007/978-981-16-1376-0
ISBN:	9789811613760$q(electronic bk.)

Semiconductor advanced packaging
Lau, John H.

Semiconductor advanced packaging[electronic resource] /by John H. Lau. - Singapore :Springer Singapore :2021. - xxii, 498 p. :ill., digital ;24 cm.

Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging.

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

ISBN: 9789811613760$q(electronic bk.)

Standard No.: 10.1007/978-981-16-1376-0doiSubjects--Topical Terms:

182501
Semiconductors
--Design and construction.

LC Class. No.: TK7871.85 / .L38 2021

Dewey Class. No.: 621.38152

Semiconductor advanced packaging
LDR:02106nmm a2200325 a 4500 001 598599
003 DE-He213
005 20210517120854.0
006 m d
007 cr nn 008maaau
008 211025s2021 si s 0 eng d
020 $a 9789811613760$q(electronic bk.)
020 $a 9789811613753$q(paper)
024 7 $a 10.1007/978-981-16-1376-0 $2 doi
035 $a 978-981-16-1376-0
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7871.85 $b .L38 2021
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.38152 $2 23
090 $a TK7871.85 $b .L366 2021
100 1 $a Lau, John H. $3 205101
245 1 0 $a Semiconductor advanced packaging $h [electronic resource] / $c by John H. Lau.
260 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2021.
300 $a xxii, 498 p. : $b ill., digital ; $c 24 cm.
505 0 $a Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging.
520 $a The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
650 0 $a Semiconductors $x Design and construction. $3 182501
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Semiconductors. $3 182134
650 2 4 $a Industrial and Production Engineering. $3 273753
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer Nature eBook
856 4 0 $u https://doi.org/10.1007/978-981-16-1376-0
950 $a Engineering (SpringerNature-11647)