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Chiplet design and heterogeneous integration packaging

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Chiplet design and heterogeneous integration packagingby John H. Lau.
作者:	Lau, John H.
出版者:	Singapore :Springer Nature Singapore :2023.
面頁冊數:	xxii, 525 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Integrated circuitsDesign and construction.
電子資源:	https://doi.org/10.1007/978-981-19-9917-8
ISBN:	9789811999178$q(electronic bk.)

Chiplet design and heterogeneous integration packaging
Lau, John H.

Chiplet design and heterogeneous integration packaging[electronic resource] /by John H. Lau. - Singapore :Springer Nature Singapore :2023. - xxii, 525 p. :ill., digital ;24 cm.

State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

ISBN: 9789811999178$q(electronic bk.)

Standard No.: 10.1007/978-981-19-9917-8doiSubjects--Topical Terms:

184690
Integrated circuits
--Design and construction.

LC Class. No.: TK7874

Dewey Class. No.: 621.3815

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520 $a The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
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