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Flip chip, hybrid bonding, fan-in, and fan-out technology

Record Type:	Electronic resources : Monograph/item
Title/Author:	Flip chip, hybrid bonding, fan-in, and fan-out technologyby John H. Lau.
Author:	Lau, John H.
Published:	Singapore :Springer Nature Singapore :2024.
Description:	xx, 501 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
Subject:	Interconnects (Integrated circuit technology)
Online resource:	https://doi.org/10.1007/978-981-97-2140-5
ISBN:	9789819721405$q(electronic bk.)

Flip chip, hybrid bonding, fan-in, and fan-out technology
Lau, John H.

Flip chip, hybrid bonding, fan-in, and fan-out technology[electronic resource] /by John H. Lau. - Singapore :Springer Nature Singapore :2024. - xx, 501 p. :ill., digital ;24 cm.

Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics.

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

ISBN: 9789819721405$q(electronic bk.)

Standard No.: 10.1007/978-981-97-2140-5doiSubjects--Topical Terms:

224341
Interconnects (Integrated circuit technology)

LC Class. No.: TK7874.53

Dewey Class. No.: 621.3815

Flip chip, hybrid bonding, fan-in, and fan-out technology
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520 $a This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
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