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Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration

Record Type:	Electronic resources : Monograph/item
Title/Author:	Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integrationby John Lau, Xuejun Fan.
Author:	Lau, John.
other author:	Fan, X. J.
Published:	Singapore :Springer Nature Singapore :2025.
Description:	xxiv, 645 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer Nature eBook
Subject:	Printed circuitsDesign and construction.
Online resource:	https://doi.org/10.1007/978-981-96-4166-6
ISBN:	9789819641666$q(electronic bk.)

Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration
Lau, John.

Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration[electronic resource] /by John Lau, Xuejun Fan. - Singapore :Springer Nature Singapore :2025. - xxiv, 645 p. :ill. (some col.), digital ;24 cm.

Chiplet Design and Heterogeneous Integration Packaging -- Advanced Substrates for Chiplet and Heterogeneous Integration -- Cu-Cu Bumpless Hybrid Bonding -- Warpage Management in Semiconductor Packaging -- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint -- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling -- Design Rules for Electromigration Failure -- Thermal Management.

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

ISBN: 9789819641666$q(electronic bk.)

Standard No.: 10.1007/978-981-96-4166-6doiSubjects--Topical Terms:

225904
Printed circuits
--Design and construction.

LC Class. No.: TK7868.P7

Dewey Class. No.: 621.381531

Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration
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505 0 $a Chiplet Design and Heterogeneous Integration Packaging -- Advanced Substrates for Chiplet and Heterogeneous Integration -- Cu-Cu Bumpless Hybrid Bonding -- Warpage Management in Semiconductor Packaging -- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint -- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling -- Design Rules for Electromigration Failure -- Thermal Management.
520 $a The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
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