李奕增

Overview

Works:	1 works in 1 publications in 1 languages

Titles

半導體封裝晶片製程材料剝離力影響研究 = A Study of the Influence of Packaging Material on Peel Strength in Semiconductor Chip Assembly by: 國立高雄大學電機工程學系--半導體製造智能化技術產業碩士專班; 李奕增 (Language materials, printed) , [撰]

Subjects