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Chip scale package (CSP) :design, ma...
~
Lau, John H.
Chip scale package (CSP) :design, materials, processes, reliability, and applications /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Chip scale package (CSP) :John H. Lau, Shi-Wei Ricky Lee.
Reminder of title:
design, materials, processes, reliability, and applications /
Author:
Lau, John H.
other author:
Lee, Shi-Wei Ricky.
Published:
New York :McGraw-Hill,c1999.
Description:
xxii, 564 p. :ill. ;24 cm.
Subject:
Integrated circuitsDesign and construction.
Online resource:
http://www.loc.gov/catdir/toc/mh022/98053224.html
Online resource:
http://www.loc.gov/catdir/enhancements/fy0602/98053224-b.html
Online resource:
http://www.loc.gov/catdir/enhancements/fy0602/98053224-d.html
ISBN:
0070383049 :
Chip scale package (CSP) :design, materials, processes, reliability, and applications /
Lau, John H.
Chip scale package (CSP) :
design, materials, processes, reliability, and applications /John H. Lau, Shi-Wei Ricky Lee. - New York :McGraw-Hill,c1999. - xxii, 564 p. :ill. ;24 cm.
Includes bibliographical references and index.
ISBN: 0070383049 :NT$2606
LCCN: 98053224 Subjects--Topical Terms:
184690
Integrated circuits
--Design and construction.
LC Class. No.: TK7874 / .L3167 1999
Dewey Class. No.: 621.3815
Chip scale package (CSP) :design, materials, processes, reliability, and applications /
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design, materials, processes, reliability, and applications /
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John H. Lau, Shi-Wei Ricky Lee.
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c1999.
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xxii, 564 p. :
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ill. ;
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24 cm.
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西方語文圖書區(四樓)
Items
1 records • Pages 1 •
1
Inventory Number
Location Name
Item Class
Material type
Call number
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Loan Status
No. of reservations
Opac note
Attachments
320000453391
西方語文圖書區(四樓)
1圖書
一般圖書
TK7874 L366 1999
一般使用(Normal)
On shelf
0
1 records • Pages 1 •
1
Multimedia
Multimedia file
http://www.loc.gov/catdir/toc/mh022/98053224.html
http://www.loc.gov/catdir/enhancements/fy0602/98053224-b.html
http://www.loc.gov/catdir/enhancements/fy0602/98053224-d.html
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